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| this is information on a product in full production. may 2016 docid028809 rev 1 1/13 ECMF4-20A42N10 common mode filter with esd protection for high speed serial interface datasheet - production data figure 1. pin configuration (top view) features ? 5ghz differential bandwidth to comply with hdmi 2.0, hdmi 1.4, usb 3.1, mipi, display port, etc. ? high common mode attenuation on lte, gsm, gps and wlan frequencies: ? -13 db at 0.7 ghz ? -23 db at 1.5 ghz ? -25 db at 2.4 ghz ? -23 db at 2.7 ghz ? -13 db at 5.0 ghz ? very low pcb space consumption ? thin package: 0.5 mm max ? lead free and rohs package ? high reduction of parasitic elements through integration applications ? notebook, laptop ? streaming box ? set top box ? portable devices description this device is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like hdmi 2.0, hdmi1.4, usb 3.1 gen 1, ethernet, mipi, display port and other high speed serial interfaces. it has a very large differential bandwidth to comply with these standards and can also protect and filter 2 differential lanes. ? 4 ) 1 / p p [ p p [ p p ' ' * 1 ' ' ' * 1 ' ' ' ' ' www.st.com
characteristics ECMF4-20A42N10 2/13 docid028809 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 15 kv i rms maximum rms current 100 ma t op operating temperature range -40 to +85 c t stg storage temperature range -55 to +150 c t l maximum lead temperature for soldering during 10s 260 c 9 & / 9 % 5 9 5 0 , 5 0 , 5 , 3 3 9 , 6 \ p e r o 3 d u d p h w h u v 9 % 5 % u h d n g r z q y r o w d j h , 5 0 / h d n d j h f x u u h q w 9 5 0 6 w d q g r i i y r o w d j h 9 & / & o d p s l q j y r o w d j h , 3 3 3 h d n s x o v h f x u u h q w table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 4.5 5.5 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 5 ? f c differential mode cut-off frequency at -3 db 5.0 ghz v cl i pp = 1 a - 8/20 s 10 v v cl measured at 30 ns, iec 61000-4-2 +8 kv contact 11 v c diode (i/o-i/o) v i/o = 0 v, f = 200 mhz to 3 ghz, v osc = 30 mv 0.2 0.3 pf c diode (i/o-gnd) v i/o = 0 v, f = 2.5 ghz to 6 ghz 0.35 0.45 pf docid028809 rev 1 3/13 ECMF4-20A42N10 characteristics 13 figure 3. differential atte nuation versus frequency (z 0 diff = 100 ? ) table 3. pin description pin number description p in number description 1 d1+ to connector 6 d2- to ic 2 d1- to connector 7 d2+ to ic 3 gnd 8 gnd 4 d2+ to connector 9 d1- to ic 5 d2- to connector 10 d1+ to ic 0 0 * * 6 ' ' g % / d q h / d q h ) + ] characteristics ECMF4-20A42N10 4/13 docid028809 rev 1 figure 4. common mode attenuation versus frequency (z 0 com = 50 ? ) figure 5. esd response to iec61000-4-2 (+8 kv contact discharge) 0 0 * * 6 & & g % / d q h / d q h ) + ] ( 6 ' o h y h o 9 s s 9 & / # q v 9 & / # q v 9 & / # q v n 9 9 9 9 9 docid028809 rev 1 5/13 ECMF4-20A42N10 characteristics 13 figure 6. esd response to iec61000-4-2 (-8 kv contact discharge) ( 6 ' o h y h o 9 s s 9 & / # q v 9 & / # q v 9 & / # q v n 9 9 9 9 9 figure 7. usb3.1 gen 1 5.0 gbps eye diagram without ECMF4-20A42N10 (without cable and eq) figure 8. usb3.1 gen 1 5.0 gbps eye diagram with ECMF4-20A42N10 (without cable and eq) characteristics ECMF4-20A42N10 6/13 docid028809 rev 1 figure 9. usb3.1 gen 2 10.0 gbps eye diagram without ECMF4-20A42N10 (without cable and eq) figure 10. usb3.1 gen 2 10.0 gbps eye diagram with ECMF4-20A42N10 (without cable and eq) figure 11. hdmi2.0 5.94 gbps eye diagram without ECMF4-20A42N10 (without cable and eq) figure 12. hdmi2.0 5.94 gbps eye diagram with ECMF4-20A42N10 (without cable and eq) docid028809 rev 1 7/13 ECMF4-20A42N10 characteristics 13 figure 15. tlp characteristic figure 13. hdmi1.4 3.35 gbps eye diagram without ECMF4-20A42N10 figure 14. hdmi1.4 3.35 gbps eye diagram with ECMF4-20A42N10 3 r v l w l y h s r o d u l w \ 1 h j d w l y h s r o d u l w \ 9 & / 9 , 3 3 $ package information ECMF4-20A42N10 8/13 docid028809 rev 1 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 qfn-10l package information figure 16. qfn-10l package outline docid028809 rev 1 9/13 ECMF4-20A42N10 package information 13 note: product marking may be rotated by 180 for assembly plant differentiation. in no case should this product marking be used to orie nt the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 19. tape and reel specifications table 4. qfn-10l package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.41 0.45 0.50 0.183 0.201 0.223 a1 0.02 0.05 0.009 0.022 a3 0.127 0.057 b 0.15 0.2 0.25 0.067 0.089 0.112 d 2.15 2.2 2.25 0.96 0.982 1.004 e 1.3 1.35 1.4 0.58 0.603 0.625 e 0.4 0.179 l 0.4 0.5 0.6 0.179 0.223 0.268 figure 17. footprint figure 18. marking 0 ) ' r w l g h q w l i \ l q j 3 l q $ o r f d w l r q 8 v h u g l u h f w l r q r i x q u h h o l q j $ o o g l p h q v l r q v d u h w \ s l f d o y d o x h v l q p p ? recommendation on pcb assembly ECMF4-20A42N10 10/13 docid028809 rev 1 3 recommendation on pcb assembly 3.1 solder paste 1. halide-free flux qualification ro l0 according to ansi/j-std-004. 2. "no clean" solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 3.2 placement 1. manual positioning is not recommended. 2. it is recommended to use th e lead recognition ca pabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy , a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of th e pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.3 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. a symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. docid028809 rev 1 11/13 ECMF4-20A42N10 recommendation on pcb assembly 13 3.4 reflow profiles figure 20. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement.maximum soldering profile corresponds to the latest ipc/jedec j-std-020 ? & v ? & ? & v 7 h p s h u d w x u h ? & ? & v ? & v 7 l p h v ? & v v h f p d [ ordering information ECMF4-20A42N10 12/13 docid028809 rev 1 4 ordering information figure 21. ordering information scheme 5 revision history table 5. ordering information order code marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty. delivery mode ECMF4-20A42N10 mf qfn-10l 5.00 mg 3000 tape and reel ) x q f w l r q ( 6 ' & r p p r q 0 r g h ) l o w h u ( & 0 ) 1 x p e h u r i o l q h v o d q h v 5 h m h f w l r q s h d n * + ] 9 h u v l r q $ 3 d f n d j h 1 ? 4 ) 1 / 1 ' l i i h u h q w l d o e d q g z l g w k * + ] table 6. document revision history date revision changes 16-may-2016 1 initial release. docid028809 rev 1 13/13 ECMF4-20A42N10 13 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics ? all rights reserved |
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